Jet Process Corporation (JPC) is a privately held TM service founded in 1991. We are the sole owner and developer of the versatile Jet Vapor Deposition (JVDTM) process for thin film solders and other thin film metal coatings.
We specialize in the deposition of lead free solders; these include eutectic and off-eutectic Gold-Tin, the Tin-Silver-Copper family, and many other lead free solder alloys. We also deposit related adhesion layers and diffusion barriers such as TiPtAu and TiNiAu.
JVD's low temperature and low vacuum operating conditions are compatible with photoresist patterns, heat sensitive substrates, and mask materials, including materials which outgas.
JVD technology has provided solder bumps for advanced technology applications in:
- semiconductor packaging
- microwave devices
- advanced sensors
JVD offers many advantages over conventional techniques such as sputtering, evaporation, CVD and electroplating, and has demonstrated its versatility in a wide variety of contract R&D and production work. JVD is an economical, safe, clean and environmentally sound process.