Jetprocess

Our Specialties

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Lead Free Solders

Gold-Tin Alloys:

80/20, 78/22, 75/25, 73/27

80/20, 78/22, 75/25, 73/27

Most Solders Commonly Used in Microelectronics :

Sn, SnAg, SnCu, SnAgCu (SAC), SnInAg, SnAgSb, SnIn, etc.

Name

Description

Adhesion/Barrier Layers

 Ti Pt Au, Ti Ni Au and others

Related Materials

Au, Ag, Sn, Ni, Cr, Ti, Ta and others

Benefits

  • Low temperature deposition on photoresist
    masks

  • Alloy deposition in atomic or nanocluster
    form; platinum cluster films

  • Solder bumps as small as 4 microns diameter

  • A high rate, economical, environmentally
    clean process

  • Fast turnaround times

www.epa.gov

ADHESION/BARRIER LAYERS   

    Ti Pt Au,  Ti Ni Au  and others

    RELATED MATERIALS

    Au,  Ag,  Sn,  Ni,  Cr,  Ti,  Ta  and others

    BENEFITS

  • Low temperature deposition on photoresist masks
  •  
  • Alloy deposition in atomic or nanocluster form;  platinum cluster films     
  • Solder bumps as small as 4 microns diameter
  • A high rate, economical, environmentally clean process
  • Fast turnaround times

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