Our Specialties Home / Solder Coatings / Our Specialties Lead Free Solders Gold-Tin Alloys: 80/20, 78/22, 75/25, 73/27 Other Solders Commonly Used in Microelectronics: SnAgSAC (SnAgCu) 387 and 305SnInAg 86.9/10/3.1SnIn 58/42SnAg 96.5/3.5 and 97.5/2.5 52/48SnAgSb, SnIn, etc. www.epa.govADHESION/BARRIER LAYERS Ti Pt Au, Ti Ni Au, Cr Pt Au and others RELATED MATERIALS Au, Ag, Sn, Ni, Cr, Ti, Ta and others BENEFITSLow temperature deposition on photoresist masksAlloy deposition in atomic or nanocluster form; platinum cluster films Solder bumps as small as 4 microns diameterA high rate, economical, environmentally clean processFast turnaround times/sites/production/files/2015-06/documents/jetprocess.pdf