Jetprocess

Our Specialties

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Lead Free Solders

Gold-Tin Alloys:

80/20, 78/22, 75/25, 73/27

Other Solders Commonly Used in Microelectronics:

SnAg

SAC (SnAgCu) 387 and 305

SnInAg 86.9/10/3.1

SnIn 58/42

SnAg 96.5/3.5 and 97.5/2.5 52/48

SnAgSb, SnIn, etc.

www.epa.gov

ADHESION/BARRIER LAYERS   

    Ti Pt Au,  Ti Ni Au, Cr Pt Au and others

   RELATED MATERIALS

    Au,  Ag,  Sn,  Ni,  Cr,  Ti,  Ta  and others

    BENEFITS

  • Low temperature deposition on photoresist masks
  • Alloy deposition in atomic or nanocluster form;  platinum cluster films     
  • Solder bumps as small as 4 microns diameter
  • A high rate, economical, environmentally clean process
  • Fast turnaround times

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